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EPOXY

CAS No.
Chemical Name:
EPOXY
Synonyms
EPOXY
CBNumber:
CB31416320
Molecular Formula:
O**
Molecular Weight:
15.9994
MDL Number:
MOL File:
Mol file

EPOXY Chemical Properties,Uses,Production

Uses

Epoxy is a high-performance adhesive largely used in the electronics industry as well as for MEMS and microfluidic applications. Some epoxies are cured by exposure to UV light and are commonly used in optical applications and dentistry. After cure, epoxies form strong bonds and smooth surfaces chemically inert to a large range of chemical substances, making them a good choice as sealing material as well as microchannels structural material. The strength of the epoxy adhesion is usually degraded at temperatures above 180°C.

EPOXY Preparation Products And Raw materials

Raw materials

Preparation Products

Global( 3)Suppliers
Supplier Tel Email Country ProdList Advantage
Hubei Xingyinhe Chemical Co., Ltd. 13437271305 1961141534@qq.com China 643 58
Jinan Jumeihui Chemical Co., Ltd 15098881566 3512833729@QQ.com China 39 58
EPOXY 61788-98-4