room temperature curing heat-resistant epoxy adhesive CY-22

CAS No.
Chemical Name:
room temperature curing heat-resistant epoxy adhesive CY-22
Synonyms
room temperature curing heat-resistant epoxy adhesive CY-22
CBNumber:
CB82124276
Molecular Formula:
Molecular Weight:
0
MDL Number:
MOL File:
Mol file

room temperature curing heat-resistant epoxy adhesive CY-22 Preparation Products And Raw materials

Raw materials

Preparation Products

room temperature curing heat-resistant epoxy adhesive CY-22