EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION
Product Description
CAS No.
Chemical Name:
EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION
CBNumber:
CB01454882
Molecular Formula:
O**
Formula Weight:
15.9994
MOL File:
Mol file
EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION Synonyms:
EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION
EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION
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EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION
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