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(SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS))

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SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS) Basic information More..
Product Name:SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS)
Synonyms:SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS)
CAS:
MF:H4Si
MW:32.11726
EINECS:
Mol File:Mol File
SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS)
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Tag: SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS)