(SILICON(IV) OXIDE SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.995% (METALS BASIS))

SILICON(IV) OXIDE SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.995% (METALS BASIS) Basic information More..
Product Name:SILICON(IV) OXIDE SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.995% (METALS BASIS)
Synonyms:SILICON(IV) OXIDE SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.995% (METALS BASIS)
CAS:
MF:O2Si
MW:60.0843
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Mol File:Mol File
SILICON(IV) OXIDE SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.995% (METALS BASIS)
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