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SIGMA-RBI
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800 736 3690 (Orders) |
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Products Intro: |
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| EPOXY EMBEDDING MEDIUM KIT Basic information |
Product Name: | EPOXY EMBEDDING MEDIUM KIT | Synonyms: | EPOXY EMBEDDING MEDIUM KIT;Epon(R) substitute embedding medium kit;Epon? substitute embedding medium kit | CAS: | | MF: | O** | MW: | 15.9994 | EINECS: | | Product Categories: | | Mol File: | Mol File | |
| EPOXY EMBEDDING MEDIUM KIT Chemical Properties |
Fp | 178 °C | storage temp. | 2-8°C |
| EPOXY EMBEDDING MEDIUM KIT Usage And Synthesis |
Uses | Epoxy Embedding Medium (Epon_812 substitute) is a very widely used embedding resin for electron microscopy, as it penetrates into the tissue specimen faster than Araldite and other polymers due to its low viscosity. Epoxy can be hardened easely and uniformly at low temperatures by the addition of DDSA, NMA and the accelerator DPM-30. Slight shrinkage does occur during curing. Epoxy embedding medium is useful for embedding a variety of tissues as a wide hardness can be obtained with this resin to suit a specific tissue type by using two different anhydride curing agents (DDSA and NMA). Universal embedding medium for semi- and ultrathin sections. | General Description | Polymerization 35 °, 45 °, 60 °C for 24 h each, alternatively 60 °C for 12 h. The components can also be ordered separately under the product numbers. |
| EPOXY EMBEDDING MEDIUM KIT Preparation Products And Raw materials |
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