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SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)

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SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS) Basic information
Product Name:SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)
Synonyms:SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS)
CAS:
MF:H4Si
MW:32.11726
EINECS:
Product Categories:
Mol File:Mol File
SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS) Structure
SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS) Chemical Properties
Safety Information
MSDS Information
SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS) Usage And Synthesis
SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS) Preparation Products And Raw materials
Tag:SILICON SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.999% (METALS BASIS) Related Product Information