Structure | Chemical Name | CAS | MF |
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Copper, N-acetyl-L-tyrosine hydroxy-terminated (S)-2-(acetylamino)-3-(4-hydroxyphenyl)-1-oxopropoxy Me siloxanes complexes
|
131044-77-4
|
|
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Copper hydrazinium sulfate
|
53433-02-6
|
CuH10N4O8S2
|
|
COPPER 1,000 PPM STANDARD SOLUTION
|
|
Cu
|
|
Copper, diazotized 4-amino-3-hydroxy-7-nitro-1-naphthalenesulfonic acid-diazotized o-toluidine-resorcinol coupling products complexes
|
90294-97-6
|
Cu
|
|
copper(1+) oleate
|
20240-06-6
|
C18H33CuO2
|
|
COPPER - 10% HCL 250ML
|
|
Cu
|
|
copper-binding protein
|
|
|
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copper (II) ethylglyoxal bis(N(4)-methylthiosemicarbazone)
|
127207-06-1
|
C8H16CuN6S2+2
|
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COPPER CHLORIDE SOLUTION
|
|
Cl2Cu
|
|
Cupric oxalate
|
5893-66-3
|
C2CuO4
|
|
COPPER(II) 3,5-DIISOPROPYLSALICYLATE HYDRATE
|
123334-28-1
|
C26H36CuO7
|
|
COPPER (II) ACRYLATE
|
20074-76-4
|
C6H6CuO4
|
|
COPPER II METHACRYLATE, MONOHYDRATE
|
19662-59-0
|
C8H12CuO5
|
|
copper 2,2'-bicinchoninate
|
76109-99-4
|
|
|
copper(II)-methyl 2-(2-aminoethyl)aminoethylpyridine-6-carboxylhistidinate
|
97542-41-1
|
C16H21CuN6O3+
|
|
Copper(II) dioxalate ion(-2)
|
|
C4CuO8-2
|
|
COPPER SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.995% (METALS BASIS)
|
|
Cu
|
|
Copper(II) tungstate
|
13587-35-4
|
CuO4W
|
|
COPPER(I)SULPHATE
|
17599-81-4
|
Cu.1/2H2O4S
|
|
Copper(II) citrate
|
17263-57-9
|
|
|
COPPER SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 6.35MM (0.250IN) THICK, 99.995% (METALS BASIS)
|
|
Cu
|
|
copper bis(histidinate)
|
12561-67-0
|
C12H14CuN6O4
|
|
Copper, bis2-(amino-.kappa.N)ethanolato-.kappa.O-
|
14215-52-2
|
C4H10CuN2O2
|
|
Cupric tartrate
|
815-82-7
|
C4H6CuO6
|
|
Copper(II) mononitrite ion(+1)
|
|
CuNO2+1
|
|
Copper(II)methoxyethoxyethoxide, 25% in methoxyethoxyethanol
|
|
C10H22CuO6
|
|
Copper trimer
|
66771-03-7
|
Cu3
|
|
COPPERBROMATE
|
|
Br2CuO6
|
|
Copper(II) tetra(diethanolmethylamine) ion(+2)
|
|
C20H52CuN4O8+2
|
|
COPPER OXYCHLORIDE SOLUTION 100UG/ML IN TOLUENE 1ML
|
|
ClCuO
|
|
COPPER SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.995% (METALS BASIS)
|
|
Cu
|
|
COPPER SHOT, 4-6MM (0.16-0.24IN), PURATRONIC®, 99.999% (METALS BASIS)
|
|
Cu
|
|
copper(I)-thiolate
|
|
Cu2S
|
|
COPPER INDIUM SELENIDE
|
12018-95-0
|
CuInSe2
|
|
COPPER SLUG, 6.35MM (0.25IN) DIA X 6.35MM (0.25IN) LENGTH, 99.996% (METALS BASIS)
|
|
Cu
|
|
Copper, bisbis(phenylmethyl)carbamodithioato-.kappa.S,.kappa.S-, (SP-4-1)-
|
34409-33-1
|
C30H32CuN2S4
|
|
COPPER STANDARD 1,000 G CU
|
|
Cu
|
|
Copper(II) hydrogen NTA
|
|
C6H7CuNO6
|
|
Copper(II) piperazine ion(+2)
|
|
C4CuH10N2+2
|
|
Copper(I) thiophenoxide, 95%
|
34012-88-9
|
C6H6CuS
|
|
Copper acetate arsenite
|
1299-88-3
|
Cu(CH3CO2)2·3Cu(AsO2)2
|
|
Copper(II) tripiperazine ion(+2)
|
|
C12CuH30N6+2
|
|
copper 2,4-dihydroxybenzoate
|
20936-33-8
|
C14H10CuO8
|
|
Copper, bis(dipropylcarbamodithioato-.kappa.S,.kappa.S)-, (SP-4-1)-
|
14354-08-6
|
|
|
copper(II)-doped dichlorobis(1,2-dimethylimidazole)zinc(II)
|
|
|
|
COPPER (II) TEREPHTHALATE TRIHYDRATE
|
28758-10-3
|
C8H10CuO7
|
|
COPPER(II) BENZENESULFINATE HYDRATE
|
64586-62-5
|
C6H6CuO2S
|
|
Cupric bromide
|
7789-45-9
|
Br2Cu
|
|
Copper-8-HydroxyQuinoline(CopperOxime)
|
|
|
|
CopperPhthalocyanineBlueCrude(Cpc)
|
|
|
|
Copper-BasedAgriculturalFungicides.PhenazopyridineHclUsp
|
|
|
|
Copper(II) tri(2-aminoethanol) ion(+2)
|
|
C6H21CuN3O3+2
|
|
copper furan-2-carboxylate
|
84009-23-4
|
C10H6CuO6
|
|
copper divalerate
|
15432-57-2
|
C10H18CuO4
|
|
COPPER HYDROXYFLUORIDE
|
|
CuFHO
|
|
Copper hydroxide sulfate
|
55200-89-0
|
Cu3H2O10S2
|
|
COPPER REAGENT NO 1
|
|
Cu
|
|
Copper ion(+1)
|
|
Cu+1
|
|
copper(2+) tert-decanoate
|
84195-98-2
|
C20H38CuO4
|
|
copper peroxydisulfate
|
63502-94-3
|
CuH2O8S2
|
|
Copper(I) Cyanide
|
544-92-3
|
CCuN
|
|
copper(2+) sulphate
|
18939-61-2
|
CuO4S
|
|
Copper[Ⅱ] 2-pyrazinecarboxylate
|
|
C10H6CuN4O4
|
|
Copper(II) di(2-aminoethanol) ion(+2)
|
|
C4H14CuN2O2+2
|
|
COPPER DNA
|
|
|
|
COPPER(II) TRIFLUOROACETATE HYDRATE
|
16712-25-7
|
C4H2CuF6O5
|
|
Copper(II) acetate
|
|
C4H6CuO4
|
|
Copper phosphide
|
12643-19-5
|
|
|
copper dihydrogen bischromate
|
68406-65-5
|
Cr2CuH2O7
|
|
Copper(II) nitrate hexahydrate
|
|
CuH12N2O12
|
|
Copper(I) iodide
|
7681-65-4
|
CuI
|
|
copper(II) octahydro-4,7-methano-1H-indenedicarboxylate
|
93776-43-3
|
C12H14CuO4
|
|
Copper (II) oxide wire
|
|
CuO
|
|
Copper(II) di(diethanolmethylamine) ion(+2)
|
|
C10H26CuN2O4+2
|
|
Copper(II) oxalate
|
814-91-5
|
C2CuO4
|
|
Copper(I) chloride
|
7758-89-6
|
ClCu
|
|
copper tetrapropenylsuccinate
|
94086-58-5
|
C16H20CuO4
|
|
copper dihydroxybenzoate
|
52856-54-9
|
C14H10CuO8
|
|
Copper(I) sulfide
|
22205-45-4
|
Cu2S
|
|
Copper (II) hydroxide sulfate.
|
1332-03-2
|
Cu.H2O.HO.O4S
|
|
COPPER PYROPHOSPHATE TETRAHYDRATE
|
|
Cu2H8O11P2
|
|
COPPER(I) CYANIDE-13C,15N
|
199450-10-7
|
CCuN
|
|
Copper(I) fluoride
|
|
CuF
|
|
COPPER FOIL, 0.025MM (0.001IN) THICK, 99.8% (METALS BASIS)
|
|
Cu
|
|
copper (II) diacetyl-di(N(4)-methylthiosemicarbazone)
|
|
|
|
COPPER(II) FLUORIDE HYDRATE 99.999%
|
71958-73-1
|
CuF2H2O
|
|
COPPER PICOLINATE
|
27744-35-0
|
C12H10CuN2O5
|
|
COPPER CONCENTRATE
|
|
Cu
|
|
Copper, 2-(2-chloroethyl)sulfonyl-5-(phenylhydrazono)methyl-3-sulfobenzoic acid-diazotized 3-amino-4-hydroxy-5-2-2-(sulfooxy)ethylsulfonylethylaminocarbonylaminobenzenesulfonic acid coupling products sodium complexes
|
152261-41-1
|
|
|
COPPER AND BRASS DIP
|
|
|
|
COPPER PCA METHYLSILANOL
|
|
|
|
Copper, bis(dihexylcarbamodithioato-.kappa.S,.kappa.S)-, (SP-4-1)-
|
62637-60-9
|
|
|
COPPERPLASMAEMISSIONSTANDARD,1ML=1MGCU
|
|
|
|
Copper, diazotized 5-amino-1-naphthalenesulfonic acid-diazotized 2-[(4-aminophenyl)amino]-5-nitrobenzenesulfonic acid-diazotized 4-nitrobenzeneamine-Dyer's mulberry extract coupling products complexes
|
72480-60-5
|
Cu
|
|
COPPER LOW TEMP (HEAT CAPACITY)
|
|
Cu
|
|
COPPER ZIRCONATE
|
70714-64-6
|
CuO3Zr
|
|
COPPER(II) TETRAFLUOROBORATE HYDRATE
|
314040-98-7
|
B2CuF8H2O
|
|
COPPER BIS-3,5-DIISOPROPYLSALICYLATE
|
21246-18-4
|
C26H32CuO6
|
|
COPPER(II) CYCLOHEXANEBUTYRATE
|
2218-80-6
|
C20H34CuO4
|
|
COPPER (II) PYROPHOSPHATE
|
304671-71-4
|
Cu2H2O8P2
|