Welcome to chemicalbook!
Chinese English Japanese Germany Korea
400-158-6606
Try our best to find the right business for you.
Do not miss inquiry messages Please log in to view all inquiry messages.

Welcome back!

ChemicalBook CAS DataBase List 4,4'-Divinylbiphenyl

4,4'-Divinylbiphenyl synthesis

11synthesis methods
The preparation of 4,4'-Divinylbiphenyl is as follows: Reaction flask (10 mL) equipped with stirring bar was charged with 4-vinylphenylboronic acid (135mg, 0.91 mmol), ethanol (96%) (2 mL), [{Pd(μ-OH)Cl(IPr)}2] (510-4 g, 4.55 × 10-7 mol). Reactionmixture was stirred at 22 C for 6 h. After completion of the reaction solvent was evaporated, theresidue was dissolved in hexane (5 mL) and extracted with water (2 × 2 mL). The organic layer wasdried over magnesium sulphate, and hexane was evaporated under reduced pressure. 176 mg of 4,4'-divinylbiphenyl was obtained as a white solid. Yield = 93%. 

4433-13-0.png

-

Yield: 93%

Reaction Conditions:

with C54H74Cl2N4O2Pd2 in ethanol at 22; for 6 h;

Steps:

4,4'-divinylbiphenyl S6 (3i)
Reaction flask (10 mL) equipped with stirring bar was charged with 4-vinylphenylboronic acid (135mg, 0.91 mmol), ethanol (96%) (2 mL), [{Pd(μ-OH)Cl(IPr)}2] (510-4 g, 4.55 × 10-7 mol). Reactionmixture was stirred at 22 C for 6 h. After completion of the reaction solvent was evaporated, theresidue was dissolved in hexane (5 mL) and extracted with water (2 × 2 mL). The organic layer wasdried over magnesium sulphate, and hexane was evaporated under reduced pressure. 176 mg of 4,4'-divinylbiphenyl was obtained as a white solid. Yield = 93%. 1H NMR (403 MHz, CDCl3, ppm) δ: 7.58(d, J = 8.4 Hz, 4H), 7.49 (d, J = 8.3 Hz, 4H), 6.76 (dd, J = 17.6, 10.9 Hz, 2H), 5.80 (d, J = 18.4 Hz,2H), 5.28 (d, J = 10.9 Hz, 2H); 13C NMR (101 MHz, CDCl3, ppm) δ: 140.0, 136.6, 136.3, 127.0,126.7, 126.6, 113.9. MS (EI) m/z (%) = 206 (M+, 100), 179 (9), 153 (10), 103 (8), 27 (10).

References:

Ostrowska, Sylwia;Rogalski, Szymon;Lorkowski, Jan;Walkowiak, Jedrzej;Pietraszuk, Cezary [Synlett,2018,vol. 29,# 13,p. 1735 - 1740] Location in patent:supporting information