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PCB substrate moisture-proof waterproof thermal conductive flame-retardant potting

PCB substrate moisture-proof waterproof thermal conductive flame-retardant potting Struktur
CAS-Nr.
Englisch Name:
PCB substrate moisture-proof waterproof thermal conductive flame-retardant potting
Synonyma:
CBNumber:
CB53005858
Summenformel:
Molgewicht:
0
MOL-Datei:
Mol file
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PCB substrate moisture-proof waterproof thermal conductive flame-retardant potting Eigenschaften

Sicherheit

PCB substrate moisture-proof waterproof thermal conductive flame-retardant potting Chemische Eigenschaften,Einsatz,Produktion Methoden

PCB substrate moisture-proof waterproof thermal conductive flame-retardant potting Upstream-Materialien And Downstream Produkte

Upstream-Materialien

Downstream Produkte

PCB substrate moisture-proof waterproof thermal conductive flame-retardant potting Anbieter Lieferant Produzent Hersteller Vertrieb Händler.

Global( 1)Lieferanten
Firmenname Telefon E-Mail Land Produktkatalog Edge Rate
Jiande Combinewin Silicone Material Co., Ltd --
 hokwu@combinewin.com China 110 50
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