moderate-temperature curing epoxy resin structural adhesive film HDG-01
- CAS No.
- Chemical Name:
- moderate-temperature curing epoxy resin structural adhesive film HDG-01
- Synonyms
- moderate-temperature curing epoxy resin structural adhesive film HDG-01
- CBNumber:
- CB02128162
- Molecular Formula:
- Molecular Weight:
- 0
- MDL Number:
- MOL File:
- Mol file
moderate-temperature curing epoxy resin structural adhesive film HDG-01 Chemical Properties,Uses,Production
moderate-temperature curing epoxy resin structural adhesive film HDG-01 Preparation Products And Raw materials
moderate-temperature curing epoxy resin structural adhesive film HDG-01