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moderate-temperature curing epoxy resin structural adhesive film HDG-01

moderate-temperature curing epoxy resin structural adhesive film HDG-01 Struktur
CAS-Nr.
Englisch Name:
moderate-temperature curing epoxy resin structural adhesive film HDG-01
Synonyma:
moderate-temperature curing epoxy resin structural adhesive film HDG-01
CBNumber:
CB02128162
Summenformel:
Molgewicht:
0
MOL-Datei:
Mol file
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moderate-temperature curing epoxy resin structural adhesive film HDG-01 Eigenschaften

Sicherheit

moderate-temperature curing epoxy resin structural adhesive film HDG-01 Chemische Eigenschaften,Einsatz,Produktion Methoden

moderate-temperature curing epoxy resin structural adhesive film HDG-01 Upstream-Materialien And Downstream Produkte

Upstream-Materialien

Protecting paper

Downstream Produkte

moderate-temperature curing epoxy resin structural adhesive film HDG-01 Anbieter Lieferant Produzent Hersteller Vertrieb Händler.

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