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POLYIMIDE RESIN

POLYIMIDE RESIN Structure
CAS No.
62929-02-6
Chemical Name:
POLYIMIDE RESIN
Synonyms
Matrimid 5218;XU 293;BTDA-DAPI;Polyimides;Polyimideresins;POLYIMIDE RESIN;polyimide P84NT;polyimide matrimid;POLYIMIDE RESIN POWDER;BTDA-diaminophenylindane
CBNumber:
CB8731898
Molecular Formula:
C35H28N2O7
Molecular Weight:
588.60602
MOL File:
62929-02-6.mol
MSDS File:
SDS
Modify Date:
2024/4/29 14:28:21

POLYIMIDE RESIN Properties

Melting point >300°C
Density 1.2
Flash point >93°(199°F)
form Powder
Specific Gravity 1.2
color Yellow
Water Solubility Insoluble in water.
EPA Substance Registry System 1,3-Isobenzofurandione, 5,5'-carbonylbis-, polymer with 1(or 3)-(4-aminophenyl)-2,3-dihydro-1,3,3(or 1,1,3)-trimethyl-1H-inden-5-amine (62929-02-6)

SAFETY

Risk and Safety Statements

Symbol(GHS) 
GHS07
Hazard statements  H315-H319-H335
Precautionary statements  P261-P280a-P304+P340-P305+P351+P338-P405-P501a
TSCA  Yes

POLYIMIDE RESIN Chemical Properties,Uses,Production

Uses

Polyimides (PI, also known by alternative brand names: Pyralin Apical, Kapton, and Kaptrex) are polymers made of imide monomers (two carbonyl groups bonded to nitrogen). It has a density of 1430 kg/m3, Young’s modulus 3200 MPa, tensile strength (75–90) MPa, glass transition temperature > 400℃, thermal conductivity of 0.53 W/(m K), and a low relative dielectric constant of 2.9. Polyimides have applications similar to BCBs and also find applications as a low dielectric constant material in high-frequency interconnects (low-k material). The higher thermal conductivity and high glass transition temperature when compared to other types of insulating polymers also makes them a good choice where heat dissipation is important or other applications requiring good thermal management or low parasitic capacitances. Microchannels and high-frequency microdevices embedded in both photosensitive and nonphotosensitive polyimides have been fabricated and reported.

Industrial uses

Available both as thermoplastic and thermosetresins, polyimides (PIs) are a family of someof the most heat- and fire-resistant polymersknown. Moldings and laminates are generallybased on thermoset resins, although some aremade from thermoplastic grades. Unlike mostplastics, polyimides are available as laminatesand shapes, molded parts, and stock shapesfrom some materials producers. Thin-film products— enamel, adhesives, and coatings — areusually derived from thermoplastic polyimideresins.
Polyimide parts and laminates can serve continuouslyin air at 260°C; service temperaturefor intermittent exposure can range from cryogenicto as high as 482°C. Glass-fiber-reinforcedversions retain over 70% of their flexuralstrength and modulus at 249°C. Creep is almostnonexistent, even at high temperatures, anddeformation under load (27.2 MPa) is less than0.05% at room temperature for 24 h.
These materials have good wear resistanceand low coefficients of friction, both of whichare further improved by polytetrafluoroethylenefillers. Self-lubricating parts containing graphitepowders have flexural strengths above 68MPa, which is considerably higher than thoseof typical thermoplastic bearing compounds.
Electrical properties of polymide moldingsare outstanding over a wide range of temperatureand humidity conditions.

POLYIMIDE RESIN Preparation Products And Raw materials

Raw materials

Preparation Products

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-2,3-dihydro-1,3,3(or1,1,3)-trimethyl-1h-inden-5-amine 3-isobenzofurandione,5,5’-carbonylbis-polymerwith1(or3)-(4-aminophenyl) POLYIMIDE RESIN Polyimideresins Polyimides 1,3-Isobenzofurandione, 5,5-carbonylbis-, polymer with 1(or 3)-(4-aminophenyl)-2,3-dihydro-1,3,3(or 1,1,3)-trimethyl-1H-inden-5-amine 5(6)-Amino-1-(4-anilino)-1,3,3-tetramethylindan-benzophenonetetracarboxylic PolyiMide filM, 0.025MM thick x 20MM width Polyimide, 0.025mm thick x 20mm width POLYIMIDE RESIN POWDER POLYIMIDE RESIN ISO 9001:2015 REACH Matrimid 5218 BTDA-DAPI BTDA-diaminophenylindane Poly(1-(4-aminophenyl)-2,3-dihydro-1,3,3-trimethyl-1H-inden-5-amine-alt-5,5-carbonylbis[1,3-isobenzofurandione]) Poly(3-(4-aminophenyl)-2,3-dihydro-1,1,3-trimethyl-1H-inden-5-amine-alt-5,5-carbonylbis(1,3-isobenzofurandione) Poly(3,3',4,4'-benzophenonetetracarboxylic dianhydride-alt-diaminophenylindane) polyimide matrimid XU 293 polyimide P84NT 62929-02-6