Product Name | MF | CAS | Details |
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Leather mold inhibitor BJQ114 | Details |
Epoxy adhesives | [C11H12O3]n | Details |
Insulating embedding adhesive | Details |
Modified amine epoxy curing agent A50 | Details |
Colorless transparent curing agent | Details |
epoxy resin adhesive | Details |
Xylylenediamine epoxy curing agent | Details |
Adhesive | Details |
Paint coating anti-mold agent BJQ82 | Details |
Aminals -105 | Details |
Underwater curing agent | Details |
m-xylenediamine | C8H12N2 | Details |
Retard dew paint | Details |
Lighting glue | Details |
Metal coating | Details |
Lead acetate trihydrate | C4H12O7Pb | 6080-56-4 | Details |
Curing agent for epoxy resin | Details |
Feed Mould inhibitor | Details |
Resin curing agent | Details |
Super glue 810 | Details |
T31 epoxy curing agent | Details |
Polyamide curing agent | Details |
Foam free surfactant | Details |
XDA | Details |
Zinc phosphorizing liquid,normal temperature | Details |
High temperature curing agent | Details |
Toughening curing agent | Details |
Curing agent A60 | Details |
Industrial repairing adhesive | [C11H12O3]n | Details |
Cardanol curing agent | Details |
CURING AGENT (POLYAMIDE BASE LIQUID) FOR EPOXY RES | Details |
SURFACTANT | C13H27SO3Na;C17H35SO3Na | Details |
Filter glue | Details |
Modified amine curing agent | Details |
Phosphide material | Details |
Titanium surface conditioner | Details |
Amine-105 epoxy resin curing agent | Details |
Modified epoxy resin curing agent | Details |
Anti-corrosion waterproof material | Details |
Black electronic potting | Details |
Sealing agent | Details |
Product Total: Product Page: | ||||
1 |