EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION
- CAS No.
- Chemical Name:
- EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION
- Synonyms
- EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION
- CBNumber:
- CB01454882
- Molecular Formula:
- O**
- Molecular Weight:
- 15.9994
- MDL Number:
- MOL File:
- Mol file
EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION Preparation Products And Raw materials
Raw materials
Preparation Products
EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION Suppliers
Global( 1)Suppliers
| Supplier | Tel | Country | ProdList | Advantage | |
|---|---|---|---|---|---|
| ChangChun Plastics. Co. Ltd. | -- | China | 83 | 57 |
| Supplier | Advantage |
|---|---|
| ChangChun Plastics. Co. Ltd. | 57 |
EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION