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EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION

EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION Struktur
CAS-Nr.
Englisch Name:
EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION
Synonyma:
EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION
CBNumber:
CB01454882
Summenformel:
O**
Molgewicht:
15.9994
MOL-Datei:
Mol file
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EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION Eigenschaften

Sicherheit

EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION Chemische Eigenschaften,Einsatz,Produktion Methoden

EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION Upstream-Materialien And Downstream Produkte

Upstream-Materialien

Downstream Produkte

EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION Anbieter Lieferant Produzent Hersteller Vertrieb Händler.

Global( 1)Lieferanten
Firmenname Telefon E-Mail Land Produktkatalog Edge Rate
ChangChun Plastics. Co. Ltd. --
 China 83 57
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