9,9-Bis(4-hydroxyphenyl)fluorene manufacturers and suppliers in india

9,9-Bis(4-hydroxyphenyl)fluorene

Properties

Melting point:: 224-226 °C (lit.)

Boiling point:: 526.4±50.0 °C(Predicted)

Density: 1.288±0.06 g/cm3(Predicted)

storage temp.: Sealed in dry,Room Temperature

solubility: Insoluble[in water]

Water Solubility: Insoluble in water

pka: 9.58±0.30(Predicted)

form: solid

color: White to Almost white

BRN: 2060986

InChIKey: YWFPGFJLYRKYJZ-UHFFFAOYSA-N

CAS DataBase Reference: 3236-71-3(CAS DataBase Reference)

EPA Substance Registry System: Phenol, 4,4'-(9H-fluoren-9-ylidene)bis- (3236-71-3)

Safety Information

Symbol(GHS): GHS07,GHS09

Signal word: Warning

Hazard statements: H315-H319-H410

Precautionary statements: P264-P273-P280-P302+P352-P305+P351+P338-P332+P313

Hazard Codes: Xi,N

Risk Statements: 36/38-50/53-36/37/38

Safety Statements: 26-37-60-61-37/39

RIDADR: UN 3077 9/PG 3

WGK Germany: 2

HazardClass: IRRITANT

PackingGroup: III

HS Code: 38220000

Use

9,9-Bis(4-hydroxyphenyl)fluorene is the monomer and modifier of functional polymer material,it is Cardo skeleton structure bisphenol compound, it is important monomer and modifier of synthesis of fluorene-based epoxy resin, fluorene and benzene benzoxazine resins, acrylic resins, polyester resins, polycarbonate, epoxy, polyester or polyether condensation products. Fluorene-based epoxy resin has excellent humidity resistance and heat resistance, dielectric properties, mechanical properties, chemical resistance, etc., it has been important monomer and modifier of high-performance resin matrix materials, electronic packaging materials, high temperature resistant adhesives, heat resistant coatings, etc. But the rigidity of fluorene-based epoxy resin is better, but toughness is poor, therefore, it need to be modified toughening when be used, or use the method of mixing with general-purpose epoxy resin to modify. The above information is edited by the chemicalbook of Wang Xiaodong.