Diethoxydimethylsilane manufacturers and suppliers in india

Diethoxydimethylsilane

Properties

Melting point:: -97°C

Boiling point:: 114 °C (lit.)

Density: 0.865 g/mL at 25 °C (lit.)

vapor pressure: 7-7910Pa at 20-25℃

refractive index: n20/D 1.381(lit.)

Flash point:: 53 °F

storage temp.: Flammables area

form: liquid

Specific Gravity: 0.939

color: ≤25(APHA)

Water Solubility: may decompose

Sensitive: Moisture Sensitive

Hydrolytic Sensitivity: 7: reacts slowly with moisture/water

BRN: 1736110

Dielectric constant: 3.2200000000000002

LogP: -0.4-3 at 25℃

Safety Information

Symbol(GHS): GHS02,GHS07

Signal word: Danger

Hazard statements: H225-H315-H319-H332

Precautionary statements: P210-P302+P352-P304+P340+P312-P305+P351+P338

Hazard Codes: F,Xi,Xn

Risk Statements: 11-36/38-20

Safety Statements: 26-36-16

RIDADR: UN 1993 3/PG 2

WGK Germany: 2

RTECS: VV3590000

TSCA: Yes

HazardClass: 3

PackingGroup: II

HS Code: 29319090

Toxicity: LD50 oral in rat: 9280mg/kg

Use

Diethoxydimethylsilane may be used to modify epoxy resin6 and the surfaces of pure silica and Pd/SiO2 hydrogen gas sensors. Surface modification results in enhanced gas sensing properties of the sensors. It may be used as a precursor for the synthesis of ultrafine SiC powder. Diethoxydimethylsilane is an intermediate silane useful for blocking hydroxyl and amino groups in organic synthesis reactions. This silylating step allows subsequent reactions to be carried out which would be adversely affected by the presence of active hydrogen in the hydroxyl or amine groups. Following the reaction step, hydroxyl or amine groups blocked with diethoxydimethylsilane may be recovered by a hydrolysis procedure. It is also used for preparing hydrophobic and release materials as well as enhancing flow of powders. Studies report its use as a precursor for ORMOSIL (Organically modified SILicates) and thin a-SiOxCyHz films.