TANTALUM NITRIDE
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- ₹6718 - ₹39753
- Product name: TANTALUM NITRIDE
- CAS: 12033-62-4
- MF: NTa
- MW: 194.95
- EINECS:234-788-4
- MDL Number:MFCD00049568
- Synonyms:Tantalum Nitride , powder (TaN);TANTALUM NITRIDE;tantalumnitride(tan) ;tantalum mononitride;TANTALUM NITRIDE, <5 MICRON, 99.5%;TANTALUM NITRIDE, 99.5% (METALS BASIS);Einecs 234-788-4;Tantalum nitride, 99.5% trace metals basis
2 prices
Selected condition：
Brand
- ALFA India
Package
- 10g
- 50g
- ManufacturerALFA India
- Product numberALF-013093-09
- Product descriptionTantalum nitride, 99.5% (metals basis)
- Packaging10g
- Price₹6718
- Updated2022-05-26
- Buy
- ManufacturerALFA India
- Product numberALF-013093-18
- Product descriptionTantalum nitride, 99.5% (metals basis)
- Packaging50g
- Price₹39753
- Updated2022-05-26
- Buy
| Manufacturer | Product number | Product description | Packaging | Price | Updated | Buy |
|---|---|---|---|---|---|---|
| ALFA India | ALF-013093-09 | Tantalum nitride, 99.5% (metals basis) | 10g | ₹6718 | 2022-05-26 | Buy |
| ALFA India | ALF-013093-18 | Tantalum nitride, 99.5% (metals basis) | 50g | ₹39753 | 2022-05-26 | Buy |
Properties
Melting point :3360°C
Density :14.6 g/cm3
solubility :insoluble in H2O; slightly soluble in aquaregia; reacts with alkaline solutions
form :Powder
color :black hexagonal, hexane crystals, crystalline
Resistivity :128–135 (ρ/μΩ.cm)
Water Solubility :Insoluble in water.
Crystal Structure :Hexagonal
CAS DataBase Reference :12033-62-4(CAS DataBase Reference)
EPA Substance Registry System :Tantalum nitride (TaN) (12033-62-4)
Density :14.6 g/cm3
solubility :insoluble in H2O; slightly soluble in aquaregia; reacts with alkaline solutions
form :Powder
color :black hexagonal, hexane crystals, crystalline
Resistivity :128–135 (ρ/μΩ.cm)
Water Solubility :Insoluble in water.
Crystal Structure :Hexagonal
CAS DataBase Reference :12033-62-4(CAS DataBase Reference)
EPA Substance Registry System :Tantalum nitride (TaN) (12033-62-4)
Safety Information
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Description
Tantalum nitride is used to create barrier or "glue" layers between copper, or other conductive metals, and dielectric insulator films such as thermal oxides. These films are deposited on top of silicon wafers during the manufacture of integrated circuits, to create thin film surface mount resistors and has other electronic applications.Related product price
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